Our applications
From global leaders with mass production to high-end small size customers with low volume high mix production, they trust us for:
SMT Assembly
Reflow Soldering, Solder Paste Inspection by Vi TECHNOLOGY, Automated Optical Inspection by Vi TECHNOLOGY
Dispensing
Genius, Selective Surface Activation, Fluid dispensing by Nordson ASYMTEK, Convection or IR Drying, UV Curing
Conformal coating
Genius, Selective Surface Activation, Selective Conformal coating by Nordson ASYMTEK, Convection or IR Drying, UV Curing
Discover our applications
REFLOW SOLDERING
The ultimate generation of forced convection reflow ovens for best performances, lowest cost of ownership and industry 4.0 ready.
SOLDER PASTE INSPECTION, distributed by EXELSIUS
PI Series allows to easily implement Solder Paste Inspection in any PCBA line. Very intuitive to use, this new generation of SPI allows non-experienced people to get the information they need.
By Vi TECHNOLOGYAUTOMATED OPTICAL INSPECTION, distributed by EXELSIUS
K Series 3D allows increased test coverage to simultaneously check component body and solder joint, without compromising inspection time.
By Vi TECHNOLOGYDispensing
GENIUS SELECTIVE SURFACE ACTIVATION
Atmospheric air pressure plasma technology improves the surface energy by adding in extreme surface (a few nanometers) a large quantity of polar chemical functions.
SELECTIVE CONFORMAL COATING SYSTEMS, distributed by EXELSIUS
SL940 Series automates your conformal coating with state-of-the-art process controls, world-leading know-how, and award winning global customers.
BY Nordson ASYMTEKCONVECTION OR IR DRYING
Convection or IR Drying is based on changing the state of the matter, else said a product applied as a liquid or a paste is to be solid after Convection or IR Drying. A wide variety of resins, glues and coatings can be dried with Convection or IR technologies.
Dispensing
UV CURING
UV curing is based on changing the state of the matter, else said a product applied as a liquid or a paste to be solid after UV irradiance. We offer both UV lamp and LED source solutions to fulfill this requirement.
FLUID DISPENSING, distributed by EXELSIUS
Dispensing processes such as Underfill, Glob Top, SMA, Dam & Fill, TIM… are used not only for components manufacturing but also to enhance components and assemblies reliability.
BY Nordson ASYMTEKCONTACT OUR TEAM
Give us a call or send us an e-mail. We will get back to you with answers to your enquiries within 48 hours on business days.
Contact usJOBS
EXELSIUS, solution provider for the Printed Circuit Board Assembly industry, is hiring !
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