The Underfill process is used to enhance component reliability in a wide variety of packages and typically in Flip Chip technologies. It consists in filling the area between the die or the component and the package or the substrate. Once dispensed, the underfill material needs to be cured in order to form a hard seal with good adhesion.
- ACCURACY ↔ Jetting Technology
- unsurpassed REPEATABILITY and PROCESS CONTROL ↔ Mass Flow Calibration
- FULL PROCESS ↔ eXelsius® provides complete line with Conveyors, IR & UV curing ovens