eXelius® offers a wide range of state-of-the-art in-line brazing units dedicated to back-end semiconductor applications including Die Attach, Packaging Sealing and Wafer Bumping under controlled atmosphere (Air, N2, H2N2, H2) working from 200°C to 600°C.
- EXTRA LOW O2 CONCENTRATION ↔ Advanced muffle technology
- ULTRA LOW GAS CONSUMPTION ↔ Better Return On Investment
- NITROGEN TO PURE HYDROGEN CAPABILITY ↔ To meet all Process requirements
